• Compact And Thin Liquid-Cooled Plate Water Cooling Distro Plate
Compact And Thin Liquid-Cooled Plate Water Cooling Distro Plate

Compact And Thin Liquid-Cooled Plate Water Cooling Distro Plate

제품 상세 정보:

원래 장소: Dongguan, 중국 광동
브랜드 이름: Uchi
인증: SMC
모델 번호: 수냉식 분배판

결제 및 배송 조건:

최소 주문 수량: 100개
가격: 협상 가능
지불 조건: T/T, 페이팔, 웨스턴 유니온, MoneyGram
공급 능력: 한 달에 50000000pcs
최고의 가격 접촉

상세 정보

전원 인터페이스: 3핀 재료: 구리와 놋쇠
소음: 17dbA 힘: 400W
표면 처리: 색은 양극 처리합니다 프로세스: 브레이징 스키브 핀
자격증: ISO 9001:2000 ISO 14001:2004 용인: 0.01-0.05mm
크기: 108*78*19.1mm 팬 삶: 100000 하스
선반 가공 공차: +/- 0.02mm 표면 처리: 아노다이징 처리, 분체 코팅, 연마, 나뭇결, 사용자 정의
강조하다:

compact liquid cooling distro plate

,

thin water cooling plate

,

liquid-cooled distro plate with warranty

제품 설명

Compact And Thin Liquid-Cooled Plate Water Cooling Distro Plate
Heat dissipation plays a pivotal role in the development of the digital economy. As the physical cornerstone of digital infrastructure and an indispensable key link in the computing power industry chain, thermal management technology strongly underpins various digital scenarios—from national-level data centers, artificial intelligence computing clusters and supercomputing centers down to personal computers, smartphones and Internet of Things (IoT) devices—serving as robust support for the steady operation and sustained growth of the digital economy.
Applications in High-end Manufacturing
Semiconductor and Chip Manufacturing
Advanced packaging technologies (e.g., 3D stacking) lead to heat accumulation inside chips, where the thermal conductivity of traditional materials has become a bottleneck.
AI Computing/Data Centers
With the surging heat flux density of chips, traditional cooling methods are struggling to meet demand, making thermal management an "invisible ceiling" that restricts computing power improvement.
Aerospace
The space environment features extreme temperatures and high vacuum, where convective heat dissipation is not feasible. Aerospace equipment is exposed to harsh temperature fluctuations.
Compact And Thin Liquid-Cooled Plate Water Cooling Distro Plate 0
Applications in Daily Life
  • Digital Devices: Internal heat dissipation modules composed of metal cooling fins are fitted in computers, mobile phones, game consoles and other devices to ensure sustained performance.
  • Communication Devices: To guarantee stability of high-speed data transmission and processing, these devices are usually equipped with large heat sinks.
  • Household Appliances: Compressors and external unit condensers require efficient heat dissipation performance as they continuously transfer heat from indoor spaces to outdoors.
  • Lighting Devices: Efficient heat dissipation design ensures luminous efficacy and long service life of LED lamp beads; energy conservation relies on heat dissipation technology.
  • New Energy Vehicles: Sophisticated liquid cooling systems maintain optimal operating temperature in electric vehicles.
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Challenges in Traditional Heat Dissipation Manufacturing
  • Traditional air-cooling technology cannot meet the 50W/cm²+ heat flux density demand of high-performance processors like AI chips
  • Thermal conductive materials performance has hit a bottleneck with conventional thermal greases struggling to exceed 5W/m*K
  • Liquid cooling technology delivers superior performance but features complex production processes and high technical requirements
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Industry Transformation and Upgrading
The heat dissipation industry is undergoing strategic transformation from supporting industry to core technology sector with clear upgrading paths:
  • Technology: Shifting from uniform heat dissipation to precision temperature control with liquid cooling as mainstream solution
  • Industrial Positioning: Transforming from manufacturer to "heat dissipation as a service" solution provider
  • Material Systems: Evolving toward high thermal conductivity and intelligence
  • Manufacturing Paradigms: Deeply integrating digitalization and additive manufacturing
This transformation represents an identity revolution from auxiliary process to leading design, with heat dissipation capacity becoming a core indicator of digital economy competitiveness.
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Cold Plate Radiator Design
Custom internal flow channel design based on customer power consumption data and heat distribution patterns. Our engineering process includes comprehensive simulation analysis with iterative parameter adjustments to achieve optimal thermal and hydraulic performance targets.
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Manufacturing Capabilities
Our mold workshop features advanced equipment including 22 electric discharge machines (EDM) of various types, including 2 MAKINO mirror EDM machines, 9 wire-cut EDM machines (3 Seibu and 1 Sodick imported from Japan), 7 spark erosion machines, 10 grinding machines, 2 milling machines and 1 lathe.
Powerful Equipment Specifications
Parameter Specification
Table Size 500×350 mm
Rapid Traverse Speed 5000 mm/min
Maximum Workpiece Weight 500 kg
Maximum Electrode Weight 50 kg
High Machining Precision
Adopting SuperSpark4 and IES (Intelligent Expert System) technologies, we provide advanced adaptive power supply and jump control to stabilize the EDM process and improve machining precision. Equipped with ultra-surface and ultra-edge generator technologies, we achieve excellent surface finish and metallurgical quality.
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Liquid Cooling System Technology
High-power liquid cooling systems require heat sinks capable of rapid heat absorption. Leveraging the high specific heat capacity of liquids, our systems transfer large amounts of heat through liquid flow, capable of dissipating heat ranging from several hundred watts to over one kilowatt.
Liquid Cold Plate Varieties
  • Buried-tube Liquid Cold Plate: Fabricated by grooving plates, burying and welding copper tubes inside, then hermetically sealing via welding. Ensures reliable liquid tightness, operational safety, and high flatness for excellent thermal contact.
  • Inserted-tube Liquid Cold Plate: Manufactured by embedding copper tubes onto aluminum plate surfaces using welding or bonding processes, with strict flatness control for minimal thermal resistance.
  • Channel-type Liquid Cold Plate: Internal flow channels formed on copper or aluminum substrates through drilling, extrusion, and precision machining, sealed via friction welding or high-temperature brazing.
  • Liquid Cooling Block: For high-power chip heat dissipation with internal flow channels created through skiving fin technology to maximize heat exchange surface area.
Product Applications
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Quality Assurance
We maintain rigorous quality standards with comprehensive testing equipment including:
  • 1 Coordinate Measuring Machine
  • 1 projector instrument
  • 2 water high pressure testing machines
  • 4 thermal resistance testing machines
  • 2 liquid leakage testing machines
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Customer Service Commitment
  • Prompt response to all inquiries
  • Competitive pricing with guaranteed quality
  • Efficient production scheduling
  • Optimal transportation solutions
  • Comprehensive technical support
Frequently Asked Questions
Are you a trading company or manufacturer?
We are a professional manufacturer of heat sinks and water cooling plates with extensive experience and a strong technical team, featuring automated and mechanized production.
Have you exported goods before and to which regions?
60% of our total production is exported to Japan, India, UK, Canada, USA, and Brazil.
How many employees do you have?
Approximately 100 employees across sales, purchasing, engineering, QA, warehouse, and production departments.
Can you provide samples if we agree with the design?
Yes, we provide samples for confirmation before mass production, along with technical drawings if required.
What packing methods do you use?
Customized packing with normal cartons and tight-proof fabric or wooden cartons for optimal protection during transportation.
Do you provide technical support for product issues?
All products are fully inspected before shipping. For any issues, we provide immediate technical solutions.

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